US 11,736,116 B2
Interdigital capacitor and multiplying digital-to-analog conversion circuit
Chunyuan Ma, Shanghai (CN); and Bingxin Li, Kista (SE)
Assigned to HUAWEI TECHNOLOGIES CO., LTD., Shenzhen (CN)
Filed by Huawei Technologies Co., Ltd., Shenzhen (CN)
Filed on Dec. 29, 2021, as Appl. No. 17/564,437.
Application 17/564,437 is a continuation of application No. PCT/CN2019/094009, filed on Jun. 29, 2019.
Prior Publication US 2022/0123762 A1, Apr. 21, 2022
Int. Cl. H03M 1/66 (2006.01); H03M 1/80 (2006.01); H01L 23/522 (2006.01); H01L 49/02 (2006.01)
CPC H03M 1/66 (2013.01) [H01L 23/5223 (2013.01); H01L 28/86 (2013.01); H03M 1/802 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An interdigital capacitor, comprising:
at least one first metal layer;
a first electrode disposed in the at least one first metal layer;
at least one first finger metal disposed in the at least one first metal layer and electrically connected to the first electrode;
a second electrode disposed in the at least one first metal layer;
a plurality of second finger metals electrically connected to the second electrode; and
at least one third finger metal electrically connected to the second electrode,
wherein the at least one first finger metal is alternately disposed with the plurality of second finger metals to form capacitors, and
wherein the at least one third finger metal is a dummy finger metal.