CPC H03H 9/02133 (2013.01) [H03H 3/0073 (2013.01); H03H 3/04 (2013.01); H03H 9/02102 (2013.01); H03H 9/02448 (2013.01); H03H 9/0523 (2013.01); H03H 9/0533 (2013.01); H03H 9/0547 (2013.01); H03H 9/1021 (2013.01); H03H 9/1057 (2013.01); H03H 9/17 (2013.01); H03H 9/2426 (2013.01); H03H 9/2457 (2013.01); H03H 2003/0407 (2013.01)] | 25 Claims |
1. A device, comprising:
a semiconductor die;
a thin-film layer;
an air cavity positioned between the semiconductor die and the thin-film layer, the air cavity comprising a resonator positioned on the semiconductor die;
a rib coupled to a surface of the thin-film layer opposite the air cavity; and
a mold compound covering the semiconductor die, the thin-film layer, and the rib.
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