US 11,736,085 B2
Metal ribs in electromechanical devices
Anindya Poddar, Sunnyvale, CA (US); Hau Nguyen, San Jose, CA (US); and Masamitsu Matsuura, Beppu (JP)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed on Aug. 25, 2020, as Appl. No. 17/2,357.
Prior Publication US 2022/0069795 A1, Mar. 3, 2022
Int. Cl. H03H 9/02 (2006.01); H03H 9/05 (2006.01); H03H 9/10 (2006.01); H03H 9/17 (2006.01); H03H 9/24 (2006.01); H03H 3/007 (2006.01); H03H 3/04 (2006.01)
CPC H03H 9/02133 (2013.01) [H03H 3/0073 (2013.01); H03H 3/04 (2013.01); H03H 9/02102 (2013.01); H03H 9/02448 (2013.01); H03H 9/0523 (2013.01); H03H 9/0533 (2013.01); H03H 9/0547 (2013.01); H03H 9/1021 (2013.01); H03H 9/1057 (2013.01); H03H 9/17 (2013.01); H03H 9/2426 (2013.01); H03H 9/2457 (2013.01); H03H 2003/0407 (2013.01)] 25 Claims
OG exemplary drawing
 
1. A device, comprising:
a semiconductor die;
a thin-film layer;
an air cavity positioned between the semiconductor die and the thin-film layer, the air cavity comprising a resonator positioned on the semiconductor die;
a rib coupled to a surface of the thin-film layer opposite the air cavity; and
a mold compound covering the semiconductor die, the thin-film layer, and the rib.