US 11,735,615 B2
Imaging device with protective resin layer and stress relaxation region
Yoshiaki Masuda, Kanagawa (JP); and Tokihisa Kaneguchi, Kanagawa (JP)
Assigned to SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
Appl. No. 16/972,668
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
PCT Filed May 14, 2019, PCT No. PCT/JP2019/019076
§ 371(c)(1), (2) Date Dec. 7, 2020,
PCT Pub. No. WO2019/239767, PCT Pub. Date Dec. 19, 2019.
Claims priority of application No. 2018-114251 (JP), filed on Jun. 15, 2018.
Prior Publication US 2021/0249463 A1, Aug. 12, 2021
Int. Cl. H01L 27/146 (2006.01)
CPC H01L 27/14636 (2013.01) [H01L 27/1464 (2013.01); H01L 27/14618 (2013.01); H01L 27/14621 (2013.01); H01L 27/14627 (2013.01); H01L 27/14634 (2013.01); H01L 27/14645 (2013.01)] 11 Claims
OG exemplary drawing
 
1. An imaging device comprising:
a photoelectric converter;
a protection member provided on a light incident side of the photoelectric converter;
a substrate opposed to the protection member with the photoelectric converter interposed therebetween and having a first surface on the photoelectric converter side and a second surface opposed to the first surface;
a rewiring layer provided in a selective region of the second surface of the substrate; and
a protective resin layer provided on the second surface of the substrate,
the second surface of the substrate having an external terminal coupling region exposed from the protective resin layer, and a stress relaxation region exposed from the protective resin layer and disposed at a position different from the external terminal coupling region, wherein the stress relaxation region is provided at a position not overlapping the rewiring layer.