US 11,735,568 B2
Semiconductor die stacks and associated systems and methods
Kyle K. Kirby, Eagle, ID (US)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Jan. 31, 2022, as Appl. No. 17/589,208.
Application 17/589,208 is a continuation of application No. 16/938,861, filed on Jul. 24, 2020, granted, now 11,239,207.
Prior Publication US 2022/0157783 A1, May 19, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 25/065 (2023.01); H01L 23/00 (2006.01); H01L 25/18 (2023.01); H01L 25/00 (2006.01)
CPC H01L 25/0657 (2013.01) [H01L 24/08 (2013.01); H01L 24/80 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06524 (2013.01); H01L 2225/06555 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1434 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A semiconductor die assembly, comprising:
a first semiconductor die including first circuitry; and
a second semiconductor die including second circuitry coupled with the first circuitry, wherein:
the first semiconductor die includes one or more first conductive components and a set of bond pads on a front side of the first semiconductor die, the first conductive components coupled with the first circuitry;
the second semiconductor die includes one or more second conductive components on a front side of the second semiconductor die, the second conductive components coupled with the second circuitry;
the second semiconductor die is arranged over the first semiconductor die such that each of the second conductive components is directly bonded to a corresponding one of the first conductive components; and
a first footprint of the first semiconductor die is larger than a second footprint of the second semiconductor die such that a portion of the front side of the first semiconductor die is exposed, the portion including the set of bond pads.