US 11,735,556 B2
Connection structure
Sakae Tanaka, Saitama (JP)
Assigned to MIKUNI ELECTRON CORPORATION, Saitama (JP)
Filed by Mikuni Electron Corporation, Saitama (JP)
Filed on Sep. 1, 2021, as Appl. No. 17/464,098.
Application 17/464,098 is a continuation of application No. 16/927,640, filed on Jul. 13, 2020, granted, now 11,133,279.
Application 16/927,640 is a continuation of application No. 16/695,592, filed on Nov. 26, 2019, granted, now 10,804,235, issued on Oct. 13, 2020.
Application 16/695,592 is a continuation of application No. 16/004,302, filed on Jun. 8, 2018, granted, now 10,580,751, issued on Mar. 3, 2020.
Claims priority of application No. 2018-015667 (JP), filed on Jan. 31, 2018.
Prior Publication US 2021/0398931 A1, Dec. 23, 2021
Int. Cl. H01L 23/00 (2006.01); H01R 4/02 (2006.01); H01R 4/04 (2006.01); H01R 43/24 (2006.01); H01R 13/405 (2006.01)
CPC H01L 24/27 (2013.01) [H01L 24/29 (2013.01); H01L 24/30 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 24/83 (2013.01); H01R 4/029 (2013.01); H01R 4/04 (2013.01); H01R 13/405 (2013.01); H01R 43/24 (2013.01); H01L 2224/27003 (2013.01); H01L 2224/2711 (2013.01); H01L 2224/2782 (2013.01); H01L 2224/27334 (2013.01); H01L 2224/29499 (2013.01); H01L 2224/3011 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/33106 (2013.01); H01L 2224/838 (2013.01); H01L 2224/83871 (2013.01); H01L 2224/83874 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A connection structure comprising:
a first electrode;
a second electrode spaced from the first electrode and opposed to the first electrode;
a first resin between the first electrode and the second electrode;
a second resin arranged between the first resin and the second electrode and surrounding the first resin outside the first electrode and the second electrode; and
at least one conductive particle surrounded by the first resin and the second resin and in contact with the first electrode and the second electrode;
wherein the first resin and the second resin have different compositions from each other, and the second resin contains a (meth)acrylic monomer containing an amide methylol structure portion or a dendrimer or hyper branch polymer structure portion.