CPC H01L 24/27 (2013.01) [H01L 24/29 (2013.01); H01L 24/30 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 24/83 (2013.01); H01R 4/029 (2013.01); H01R 4/04 (2013.01); H01R 13/405 (2013.01); H01R 43/24 (2013.01); H01L 2224/27003 (2013.01); H01L 2224/2711 (2013.01); H01L 2224/2782 (2013.01); H01L 2224/27334 (2013.01); H01L 2224/29499 (2013.01); H01L 2224/3011 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/33106 (2013.01); H01L 2224/838 (2013.01); H01L 2224/83871 (2013.01); H01L 2224/83874 (2013.01)] | 16 Claims |
1. A connection structure comprising:
a first electrode;
a second electrode spaced from the first electrode and opposed to the first electrode;
a first resin between the first electrode and the second electrode;
a second resin arranged between the first resin and the second electrode and surrounding the first resin outside the first electrode and the second electrode; and
at least one conductive particle surrounded by the first resin and the second resin and in contact with the first electrode and the second electrode;
wherein the first resin and the second resin have different compositions from each other, and the second resin contains a (meth)acrylic monomer containing an amide methylol structure portion or a dendrimer or hyper branch polymer structure portion.
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