CPC H01L 24/02 (2013.01) [H01L 21/6835 (2013.01); H01L 23/562 (2013.01); H01L 24/97 (2013.01); H01L 25/0655 (2013.01); H01L 21/4857 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 23/295 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 25/50 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81005 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/92125 (2013.01); H01L 2224/97 (2013.01); H01L 2924/1432 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/18161 (2013.01); H01L 2924/351 (2013.01); H01L 2924/3511 (2013.01)] | 20 Claims |
1. An apparatus, comprising:
a redistribution layer;
at least one active die mounted on the redistribution layer within a die mounting area;
at least one dummy die mounted on the redistribution layer within a peripheral area located adjacent to and at least partially surrounding the die mounting area; and
at least one electrically isolated, inactive dummy pad located outside the die mounting area and within the peripheral area, the at least one dummy die mounted on a single respective electrically isolated, inactive dummy pad.
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