US 11,735,540 B2
Apparatuses including dummy dice
Shing-Yih Shih, New Taipei (TW); and Neng-Tai Shih, New Taipei (TW)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Feb. 17, 2021, as Appl. No. 17/177,431.
Application 16/540,444 is a division of application No. 16/039,652, filed on Jul. 19, 2018, granted, now 10,446,509, issued on Oct. 15, 2019.
Application 17/177,431 is a continuation of application No. 16/540,444, filed on Aug. 14, 2019, granted, now 10,937,749.
Application 16/039,652 is a continuation of application No. 14/730,231, filed on Jun. 3, 2015, granted, now 10,043,769, issued on Aug. 7, 2018.
Prior Publication US 2021/0175188 A1, Jun. 10, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/00 (2006.01); H01L 21/683 (2006.01); H01L 25/065 (2023.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/29 (2006.01); H01L 25/00 (2006.01)
CPC H01L 24/02 (2013.01) [H01L 21/6835 (2013.01); H01L 23/562 (2013.01); H01L 24/97 (2013.01); H01L 25/0655 (2013.01); H01L 21/4857 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 23/295 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 25/50 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81005 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/92125 (2013.01); H01L 2224/97 (2013.01); H01L 2924/1432 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/18161 (2013.01); H01L 2924/351 (2013.01); H01L 2924/3511 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
a redistribution layer;
at least one active die mounted on the redistribution layer within a die mounting area;
at least one dummy die mounted on the redistribution layer within a peripheral area located adjacent to and at least partially surrounding the die mounting area; and
at least one electrically isolated, inactive dummy pad located outside the die mounting area and within the peripheral area, the at least one dummy die mounted on a single respective electrically isolated, inactive dummy pad.