CPC H01L 23/5386 (2013.01) [H01L 21/4857 (2013.01); H01L 23/49805 (2013.01); H01L 23/49811 (2013.01); H01L 23/5381 (2013.01); H01L 23/5385 (2013.01); H01L 24/16 (2013.01); H01L 25/0655 (2013.01); H01L 2224/16227 (2013.01)] | 19 Claims |
1. An integrated circuit package, comprising:
a substrate including at least one electrical connection to at least one of power or ground; and
a bridge structure coupled to the substrate, the bridge structure including:
a bridge-chip interconnect made of conductive material,
at least one layer of conductive material in direct contact with the bridge-chip interconnect and electrically connected to the at least one electrical connection of the substrate,
at least one layer of insulative material,
a side pad made of conductive material forming an end face of the bridge structure such that the side pad is in direct contact with the at least one layer of conductive material and with the at least one layer of insulative material, and
an additional connection made of conductive material and arranged in direct contact with the side pad and with the bridge-chip interconnect, the additional connection separated from the at least one layer of conductive material by the at least one layer of insulative material and electrically connects only the side pad and the bridge-chip interconnect.
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