US 11,735,528 B2
Semiconductor memory stacks connected to processing units and associated systems and methods
Kyle K. Kirby, Eagle, ID (US)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Jan. 31, 2022, as Appl. No. 17/588,694.
Application 17/588,694 is a continuation of application No. 16/938,844, filed on Jul. 24, 2020, granted, now 11,239,169.
Prior Publication US 2022/0157728 A1, May 19, 2022
Int. Cl. H01L 23/538 (2006.01); G11C 5/02 (2006.01); G11C 5/06 (2006.01); H01L 21/50 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/5384 (2013.01) [G11C 5/025 (2013.01); G11C 5/06 (2013.01); H01L 21/50 (2013.01); H01L 21/76877 (2013.01); H01L 23/5385 (2013.01); H01L 24/14 (2013.01); H01L 25/0657 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor die assembly, comprising:
a first memory controller carrying a first stack of memory dies on a front side thereof, wherein an edge of the first memory controller extends past a corresponding edge of the first stack of memory dies such that a portion of the front side of the first memory controller is exposed, the exposed portion including a first plurality of conductive components;
a second memory controller carrying a second stack of memory dies on a front side thereof, wherein an edge of the second memory controller extends past a corresponding edge of the second stack of memory dies such that a portion of the front side of the second memory controller is exposed, the exposed portion including a second plurality of conductive components;
a processor including first and second groups of conductive components on a front side thereof, wherein the processor is arranged over both the first and second memory controllers such that each of the conductive components of the first plurality is coupled with a corresponding one of the conductive components of the first group, and each of the conductive components of the second plurality is coupled with a corresponding one of the conductive components of the second group.