CPC H01L 23/5384 (2013.01) [G11C 5/025 (2013.01); G11C 5/06 (2013.01); H01L 21/50 (2013.01); H01L 21/76877 (2013.01); H01L 23/5385 (2013.01); H01L 24/14 (2013.01); H01L 25/0657 (2013.01)] | 20 Claims |
1. A semiconductor die assembly, comprising:
a first memory controller carrying a first stack of memory dies on a front side thereof, wherein an edge of the first memory controller extends past a corresponding edge of the first stack of memory dies such that a portion of the front side of the first memory controller is exposed, the exposed portion including a first plurality of conductive components;
a second memory controller carrying a second stack of memory dies on a front side thereof, wherein an edge of the second memory controller extends past a corresponding edge of the second stack of memory dies such that a portion of the front side of the second memory controller is exposed, the exposed portion including a second plurality of conductive components;
a processor including first and second groups of conductive components on a front side thereof, wherein the processor is arranged over both the first and second memory controllers such that each of the conductive components of the first plurality is coupled with a corresponding one of the conductive components of the first group, and each of the conductive components of the second plurality is coupled with a corresponding one of the conductive components of the second group.
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