US 11,735,508 B2
Vertical and horizontal circuit assemblies
Jerome Teysseyre, Scottsdale, AZ (US); Romel Manatad, Liloan (PH); Chung-Lin Wu, San Jose, CA (US); Bigildis Dosdos, San Jose, CA (US); Erwin Ian Almagro, Lapu-Lapu (PH); and Maria Cristina Estacio, Lapulapu (PH)
Assigned to SEMICONDUCTOR COMONENTS INDUTRIES, LLC, Phoenix, AZ (US)
Filed by SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US)
Filed on Nov. 4, 2021, as Appl. No. 17/453,623.
Application 17/453,623 is a continuation of application No. 16/279,336, filed on Feb. 19, 2019, granted, now 11,177,203.
Application 16/279,336 is a continuation of application No. 15/692,354, filed on Aug. 31, 2017, granted, now 10,256,178, issued on Apr. 9, 2019.
Claims priority of provisional application 62/383,753, filed on Sep. 6, 2016.
Prior Publication US 2022/0059443 A1, Feb. 24, 2022
Int. Cl. H01L 23/498 (2006.01); H01L 23/495 (2006.01)
CPC H01L 23/49827 (2013.01) [H01L 23/495 (2013.01); H01L 23/49575 (2013.01); H01L 23/49586 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48247 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a leadframe including a plurality of leads;
an assembly including a substrate and a plurality of semiconductor die disposed on the substrate, the assembly being coupled to the leadframe;
a molding compound that at least partially encapsulates the leadframe and the assembly; and
an inductor having a first terminal and a second terminal,
the first terminal of the inductor being electrically coupled with a first contact pad of the leadframe, the first contact pad being exposed through a mold cavity defined in the molding compound, at least a portion of the first terminal being recessed in the mold cavity,
the second terminal of the inductor being electrically coupled with a second contact pad of the leadframe, and
the leadframe, the assembly and the inductor being arranged in a stacked configuration.