US 11,735,496 B2
Piezoelectric MEMS-based active cooling for heat dissipation in compute devices
Suryaprakash Ganti, Los Altos, CA (US); and Seshagiri Rao Madhavapeddy, La Jolla, CA (US)
Assigned to Frore Systems Inc., San Jose, CA (US)
Filed by Frore Systems Inc., San Jose, CA (US)
Filed on Jan. 21, 2021, as Appl. No. 17/154,970.
Application 17/154,970 is a continuation of application No. 16/369,766, filed on Mar. 29, 2019, granted, now 10,943,850.
Claims priority of provisional application 62/717,474, filed on Aug. 10, 2018.
Prior Publication US 2021/0143084 A1, May 13, 2021
Int. Cl. H05K 7/20 (2006.01); H01L 23/46 (2006.01); F04B 43/04 (2006.01); H01L 23/473 (2006.01); H10N 30/20 (2023.01); F04B 17/00 (2006.01); F04B 39/06 (2006.01); F04B 43/09 (2006.01); F04B 45/04 (2006.01); F04B 45/047 (2006.01); F04B 53/10 (2006.01); F04D 33/00 (2006.01); F25B 21/02 (2006.01); H01L 23/42 (2006.01); H01L 23/427 (2006.01); H01L 23/433 (2006.01); H04M 1/02 (2006.01); H10N 30/80 (2023.01); B06B 1/06 (2006.01); F04B 43/08 (2006.01)
CPC H01L 23/4735 (2013.01) [B06B 1/06 (2013.01); F04B 17/003 (2013.01); F04B 39/06 (2013.01); F04B 43/046 (2013.01); F04B 43/095 (2013.01); F04B 45/043 (2013.01); F04B 45/047 (2013.01); F04B 53/1077 (2013.01); F04D 33/00 (2013.01); F25B 21/02 (2013.01); H01L 23/42 (2013.01); H01L 23/427 (2013.01); H01L 23/433 (2013.01); H01L 23/4336 (2013.01); H01L 23/46 (2013.01); H01L 23/473 (2013.01); H04M 1/0202 (2013.01); H05K 7/20 (2013.01); H05K 7/20009 (2013.01); H05K 7/2039 (2013.01); H05K 7/20272 (2013.01); H05K 7/20281 (2013.01); H10N 30/20 (2023.02); H10N 30/204 (2023.02); H10N 30/2047 (2023.02); H10N 30/80 (2023.02); F04B 43/08 (2013.01); F25B 2321/023 (2013.01); F25B 2321/025 (2013.01); F25B 2321/0212 (2013.01); F25B 2321/0252 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An active cooling system comprising:
a first side of a cooling element, the first side being distal to a heat-generating structure and in communication with a fluid;
a second side of the cooling element opposite to the first side of the cooling element, the second side being proximal to the heat-generating structure, the cooling element being configured to be actuated to direct the fluid from the first side to the second side using vibrational motion such that the fluid moves in a direction that is incident on a surface of the heat-generating structure to extract heat from the heat-generating structure, the cooling element being substantially flat when not actuated; and
an orifice plate having at least one orifice therein, the orifice plate being disposed between the cooling element and the heat-generating structure such that the vibrational motion directs the fluid through the at least one orifice toward the heat-generating structure, the second side of the cooling element facing the orifice plate and being not more than three hundred micrometers from the orifice plate when not actuated.