US 11,735,495 B2
Active package cooling structures using molded substrate packaging technology
Omkar Karhade, Chandler, AZ (US); Mitul Modi, Phoenix, AZ (US); Edvin Cetegen, Chandler, AZ (US); and Aastha Uppal, Chandler, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Feb. 27, 2019, as Appl. No. 16/287,653.
Prior Publication US 2020/0273775 A1, Aug. 27, 2020
Int. Cl. H01L 23/46 (2006.01); F28D 15/02 (2006.01); H01L 21/48 (2006.01); H01L 23/427 (2006.01)
CPC H01L 23/46 (2013.01) [F28D 15/02 (2013.01); H01L 21/4882 (2013.01); H01L 23/427 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A microelectronic device package structure, comprising:
a substrate structure comprising one or more traces adjacent to a mold material, wherein the traces comprise a metal;
an integrated circuit (IC) die physically coupled to the substrate structure, and electrically coupled to at least one of the traces; and
a fluid conduit within the substrate structure, wherein at least a portion of the fluid conduit comprises the metal, and wherein the fluid conduit comprises an inlet to receive a fluid into the substrate structure and an outlet to discharge the fluid from the substrate structure with a length of the fluid conduit therebetween.