US 11,735,232 B2
Memory device with split power supply capability
Christopher Cox, San Jose, CA (US)
Assigned to MONTAGE TECHNOLOGY CO., LTD., Shanghai (CN)
Filed by MONTAGE TECHNOLOGY CO., LTD., Shanghai (CN)
Filed on Mar. 15, 2021, as Appl. No. 17/202,326.
Prior Publication US 2022/0293139 A1, Sep. 15, 2022
Int. Cl. G11C 5/04 (2006.01); G11C 5/14 (2006.01); H05K 1/18 (2006.01)
CPC G11C 5/147 (2013.01) [G11C 5/04 (2013.01); H05K 1/181 (2013.01); H05K 2201/10159 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A memory device, comprising:
a printed circuit board having a plurality of conductive layers;
memory chips mounted over the printed circuit board, wherein the memory chips comprise at least a first number of memory chips and a second number of memory chips;
a first power module mounted over the printed circuit board and for providing a first set of power supplies to the first number of memory chips through the plurality of conductive layers; and
a second power module mounted over the printed circuit board and for providing a second set of power supplies to the second number of memory chips through the plurality of conductive layers;
wherein at least one of the first set of power supplies and the second set of power supplies are configurable to provide an adjustable supply voltage or supply current, so as to satisfy a voltage or current requirement of the corresponding one of the first number of memory chips and the second number of memory chips.