US 11,733,610 B2
Method and system to monitor a process apparatus
Wim Tjibbo Tel, Helmond (NL); Mark John Maslow, Eindhoven (NL); Frank Staals, Eindhoven (NL); and Paul Christiaan Hinnen, Veldhoven (NL)
Assigned to ASML NETHERLANDS B.V., Veldhoven (NL)
Filed by ASML NETHERLANDS B.V., Veldhoven (NL)
Filed on Dec. 20, 2019, as Appl. No. 16/722,557.
Application 16/722,557 is a continuation of application No. 16/327,363, granted, now 10,571,806, previously published as PCT/EP2017/069669, filed on Aug. 3, 2017.
Claims priority of application No. 16187040 (EP), filed on Sep. 2, 2016.
Prior Publication US 2020/0124968 A1, Apr. 23, 2020
This patent is subject to a terminal disclaimer.
Int. Cl. G03F 7/20 (2006.01); G03F 7/00 (2006.01); H01L 21/66 (2006.01)
CPC G03F 7/2043 (2013.01) [G03F 7/705 (2013.01); G03F 7/70616 (2013.01); G03F 7/70625 (2013.01); G03F 7/70633 (2013.01); H01L 22/12 (2013.01); H01L 22/20 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method, comprising:
estimating, by a hardware computer system, a characteristic that will be imparted to a substrate to be processed by one or more process apparatuses by combining one or more values of one or more contributions to the characteristic by the one or more process apparatuses with one or more values of the characteristic, at least one of the one or more contributions to the characteristic being of a deposition tool configured to perform atomic layer deposition, chemical vapor deposition and/or a physical vapor deposition and being a contribution separate from a contribution to the characteristic by one or more other process apparatuses.