US 11,733,044 B2
Inertial sensor and method for manufacturing the same
Yuuki Inagaki, Nisshin (JP); Yusuke Kawai, Nisshin (JP); Takahiko Yoshida, Nisshin (JP); Shota Harada, Nisshin (JP); Katsuaki Goto, Nisshin (JP); and Keitaro Ito, Nisshin (JP)
Assigned to DENSO CORPORATION, Kariya (JP); TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota (JP); and MIRISE Technologies Corporation, Nisshin (JP)
Filed by DENSO CORPORATION, Kariya (JP); TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota (JP); and MIRISE Technologies Corporation, Nisshin (JP)
Filed on Apr. 27, 2022, as Appl. No. 17/730,284.
Claims priority of application No. 2021-086425 (JP), filed on May 21, 2021.
Prior Publication US 2022/0373332 A1, Nov. 24, 2022
Int. Cl. G01C 19/5712 (2012.01)
CPC G01C 19/5712 (2013.01) 8 Claims
OG exemplary drawing
 
1. An inertial sensor comprising:
a lower substrate including a support portion, an etching groove surrounding the support portion, a wire extending across the etching groove, and a lower metal film covering the support portion; and
an upper substrate including a micro oscillator, electrodes, and a pad, which are independent of each other, wherein
the micro oscillator includes:
a curved surface portion having a three-dimensional curved surface;
a joint portion recessed inward from an apex of the curved surface portion and joined to the support portion of the lower substrate;
a rim formed at an end of the curved surface portion opposite to the joint portion; and
a conductive film covering an outer surface and an inner surface of the micro oscillator,
the curved surface portion is in an aerial state in which the curved surface portion is not in contact with other members,
the rim is made of the same material as the electrodes,
the rim is coplanar with a virtual flat plane formed by the electrodes,
the rim is apart from and surrounded by the electrodes, and
a portion of the conductive film that covers the joint portion is electrically bonded to the lower metal film.