	US 11,732,164 B2
	Low-dielectric adhesive composition
Ryo Sonoda, Shiga (JP); Tadahiko Mikami, Shiga (JP); and Tetsuo Kawakusu, Shiga (JP)
Assigned to TOYOBO MC CORPORATION, Osaka (JP)
Appl. No. 16/767,251
Filed by TOYOBO CO., LTD., Osaka (JP)
PCT Filed May 17, 2019, PCT No. PCT/JP2019/019658 § 371(c)(1), (2) Date May 27, 2020, PCT Pub. No. WO2019/230445, PCT Pub. Date Dec. 5, 2019.
Claims priority of application No. 2018-101490 (JP), filed on May 28, 2018; and application No. 2018-101491 (JP), filed on May 28, 2018.
Prior Publication US 2021/0002523 A1, Jan. 7, 2021
Int. Cl. C09J 11/06 (2006.01); C09J 7/30 (2018.01); C09J 11/08 (2006.01); C08L 63/00 (2006.01); C08L 79/08 (2006.01); C08K 5/06 (2006.01); H05K 1/03 (2006.01); B32B 15/09 (2006.01); B32B 15/12 (2006.01); B32B 15/20 (2006.01); B32B 27/10 (2006.01); B32B 15/18 (2006.01); C09J 123/26 (2006.01); H05K 1/02 (2006.01); H05K 1/05 (2006.01)

CPC C09J 123/26 (2013.01) [C09J 11/06 (2013.01); H05K 1/028 (2013.01); H05K 1/056 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0355 (2013.01)]

9 Claims

1. An adhesive composition of varnish type comprising an acid-modified polyolefin (a), an oligo-phenylene ether (b) having a number-average molecular weight of 3000 or less, an epoxy resin (c), and an organic solvent, wherein the adhesive composition comprises 0.05 to 100 part(s) by mass of the oligo-phenylene ether (b) to 100 parts by mass of the acid-modified polyolefin (a); and

wherein the adhesive composition satisfies the following requirement (B) and optionally further satisfies the following requirement (A):

(A) the adhesive composition comprises more than 20 parts by mass and 60 parts by mass or less of the epoxy resin (c) to 100 parts by mass of the acid-modified polyolefin (a);

(B) the adhesive composition comprises 0.5 to 20 part(s) by mass of a polycarbodiimide (d) to 100 parts by mass of the acid-modified polyolefin (a) and 0.5 to 60 part(s) by mass of the epoxy resin (c) to 100 parts by mass of the acid-modified polyolefin (a).