	US 11,732,124 B2
	Compound and tablet
Kazumasa Takeuchi, Tokyo (JP); Chio Ishihara, Tokyo (JP); Hideo Maeda, Tokyo (JP); Masahiko Osaka, Tokyo (JP); and Takashi Inagaki, Tokyo (JP)
Assigned to RESONAC CORPORATION, Tokyo (JP)
Appl. No. 16/767,442
Filed by HITACHI CHEMICAL COMPANY, LTD., Tokyo (JP)
PCT Filed Nov. 30, 2017, PCT No. PCT/JP2017/043194 § 371(c)(1), (2) Date May 27, 2020, PCT Pub. No. WO2019/106813, PCT Pub. Date Jun. 6, 2019.
Prior Publication US 2020/0385566 A1, Dec. 10, 2020
Int. Cl. C08L 63/00 (2006.01); H01F 1/153 (2006.01); C08L 91/06 (2006.01); C08K 3/08 (2006.01)

CPC C08L 63/00 (2013.01) [C08L 91/06 (2013.01); H01F 1/153 (2013.01); C08K 2003/0856 (2013.01); C08L 2203/20 (2013.01); C08L 2205/03 (2013.01)]

15 Claims

1. A compound comprising:

a resin composition comprising an epoxy resin, a phenol resin, a wax, and an imidazole compound; and

a metal element-containing powder,

wherein the epoxy resin comprises a crystalline epoxy resin,

wherein a content of the wax is 0.3 to 1.2 mass % based on the total mass of the compound, and the wax comprises a montanic acid ester, and

wherein a content of the metal element-containing powder is 90 mass % or more based on the total mass of the compound.