US 11,731,433 B2
Thermal head and thermal printer
Narito Kaji, Aira (JP); Yosuke Iwamoto, Kirishima (JP); and Ryohei Matsubara, Kirishima (JP)
Assigned to KYOCERA CORPORATION, Kyoto (JP)
Appl. No. 17/778,401
Filed by KYOCERA CORPORATION, Kyoto (JP)
PCT Filed Nov. 19, 2020, PCT No. PCT/JP2020/043259
§ 371(c)(1), (2) Date May 19, 2022,
PCT Pub. No. WO2021/100822, PCT Pub. Date May 27, 2021.
Claims priority of application No. 2019-211866 (JP), filed on Nov. 22, 2019.
Prior Publication US 2022/0396081 A1, Dec. 15, 2022
Int. Cl. B41J 2/335 (2006.01); B41J 2/345 (2006.01)
CPC B41J 2/335 (2013.01) [B41J 2/345 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A thermal head, comprising:
a head base comprising a substrate;
a wiring board located adjacent to the head base;
a plurality of recessed portions located between the substrate and the wiring board;
a contact portion located between adjacent recessed portions of the plurality of recessed portions, the contact portion being configured to come into contact with the substrate and the wiring board;
a plurality of drive ICs located on a first surface of the wiring board to face a corresponding each recessed portion of the plurality of recessed portions;
a plurality of wire members located across the plurality of recessed portions, the plurality of wire members being configured to electrically connect the substrate and the plurality of drive ICs; and
a resin member configured to seal the plurality of wire members and the plurality of drive ICs.