CPC B41J 2/335 (2013.01) [B41J 2/345 (2013.01)] | 12 Claims |
1. A thermal head, comprising:
a head base comprising a substrate;
a wiring board located adjacent to the head base;
a plurality of recessed portions located between the substrate and the wiring board;
a contact portion located between adjacent recessed portions of the plurality of recessed portions, the contact portion being configured to come into contact with the substrate and the wiring board;
a plurality of drive ICs located on a first surface of the wiring board to face a corresponding each recessed portion of the plurality of recessed portions;
a plurality of wire members located across the plurality of recessed portions, the plurality of wire members being configured to electrically connect the substrate and the plurality of drive ICs; and
a resin member configured to seal the plurality of wire members and the plurality of drive ICs.
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