US 11,731,240 B2
Substrate processing apparatus
Kuniaki Yamaguchi, Tokyo (JP); Itsuki Kobata, Tokyo (JP); Toshio Mizuno, Tokyo (JP); Mitsuru Miyazaki, Tokyo (JP); Naoki Toyomura, Tokyo (JP); and Takuya Inoue, Tokyo (JP)
Assigned to EBARA CORPORATION, Tokyo (JP)
Filed by EBARA CORPORATION, Tokyo (JP)
Filed on Dec. 20, 2018, as Appl. No. 16/228,525.
Application 15/604,328 is a division of application No. 14/832,767, filed on Aug. 21, 2015, granted, now 9,700,988, issued on Jul. 11, 2017.
Application 16/228,525 is a continuation of application No. 15/604,328, filed on May 24, 2017, granted, now 10,201,888.
Claims priority of application No. 2014-171837 (JP), filed on Aug. 26, 2014; application No. 2014-171841 (JP), filed on Aug. 26, 2014; application No. 2014-185489 (JP), filed on Sep. 11, 2014; application No. 2014-185508 (JP), filed on Sep. 11, 2014; application No. 2014-195584 (JP), filed on Sep. 25, 2014; and application No. 2014-257563 (JP), filed on Dec. 19, 2014.
Prior Publication US 2019/0118338 A1, Apr. 25, 2019
Int. Cl. H01L 21/00 (2006.01); B24B 53/017 (2012.01); B08B 3/02 (2006.01); B08B 1/04 (2006.01); H01L 21/67 (2006.01)
CPC B24B 53/017 (2013.01) [B08B 1/04 (2013.01); B08B 3/02 (2013.01); H01L 21/67046 (2013.01); H01L 21/67051 (2013.01); B08B 2203/0288 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A method of cleaning a support surface of a buff table of an apparatus for buff-processing a processing target object, the buff table being for supporting the processing target object,
the apparatus comprising: a nozzle for supplying the support surface with a chemical solution for cleaning the support surface of the buff table; and
a buff head to which a buff pad for buff-processing the processing target object through physical contact is attached, wherein the buff head is configured such that a cleaning member including a brush or a sponge member for cleaning the support surface of the buff table through physical contact is attached to the buff head;
wherein the buff table includes a fluid passage that extends to the support surface and is for supplying a fluid to the support surface through the buff table while the support surface of the buff table is cleaned,
wherein the fluid passage is configured to communicate with a pure water and/or chemical solution supply source, and
wherein the fluid passage is configured to be communicable with a vacuum source for causing the processing target object to be vacuum-sucked onto the support surface while the processing target object is buff-processed,
the method comprising: a step of supplying the support surface with a chemical solution from the nozzle for cleaning the support surface of the buff table; and
a step of cleaning the support surface of the buff table through physical contact using the brush or the sponge member.