US 11,731,229 B2
Substrate processing apparatus, substrate processing method, and storage medium
Osamu Miyahara, Kumamoto (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Sep. 20, 2018, as Appl. No. 16/136,476.
Claims priority of application No. 2017-180542 (JP), filed on Sep. 20, 2017.
Prior Publication US 2019/0084117 A1, Mar. 21, 2019
Int. Cl. B24B 29/00 (2006.01); H01L 21/67 (2006.01); B24B 37/005 (2012.01); B24B 49/00 (2012.01); H01L 21/687 (2006.01); H01L 21/306 (2006.01)
CPC B24B 29/005 (2013.01) [B24B 37/005 (2013.01); B24B 49/006 (2013.01); H01L 21/30625 (2013.01); H01L 21/67017 (2013.01); H01L 21/67046 (2013.01); H01L 21/67051 (2013.01); H01L 21/67219 (2013.01); H01L 21/67253 (2013.01); H01L 21/68785 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A substrate processing apparatus comprising:
a substrate holder configured to hold a substrate in a horizontal direction;
a rotation driver configured to rotate the substrate holder so as to rotate the substrate held by the substrate holder around a vertical axis;
a polishing brush configured to polish a target surface of the substrate, the polishing brush including a forefront point on a radially outermost portion of a polishing surface of the polishing brush facing an advancing direction of the polishing brush;
a polishing brush mover configured to move the polishing brush in a horizontal direction while pressing the polishing brush against the substrate that is rotating while being held by the substrate holder; and
a controller configured to control an operation of the substrate processing apparatus including the substrate holder, the rotation driver, and the polishing brush mover, and to establish an initial position where the polishing brush is first pressed against the substrate,
wherein the forefront point of the polishing brush coincides with the center of rotation of the substrate in the initial position, and
wherein the controller is configured to:
bring the polishing brush into contact with the substrate at the initial position,
move the polishing brush in the advancing direction from the initial position to a radially outer side of the substrate when the polishing brush is in contact with the substrate, and
control the rotation driver and the polishing brush mover such that a rotation speed of the substrate decreases either stepwise or continuously and a moving speed of the polishing brush in a radial direction of the substrate decreases either stepwise or continuously as a distance from a center of rotation of the substrate measured in the radial direction of the substrate to a center of the polishing brush increases as the polishing brush is moved along the advancing direction from the initial position to the radially outer side of the substrate.