US 11,731,205 B2
Resistance soldering method and soldering device
Matevz Tavcar, Komen (SI)
Assigned to Mahle International GmbH
Filed by Matevz Tavcar, Komen (SI)
Filed on Apr. 16, 2020, as Appl. No. 16/851,068.
Claims priority of application No. 19169813 (EP), filed on Apr. 17, 2019.
Prior Publication US 2020/0331084 A1, Oct. 22, 2020
Int. Cl. B23K 1/00 (2006.01); B23K 3/00 (2006.01); B23K 3/08 (2006.01)
CPC B23K 1/0004 (2013.01) [B23K 3/08 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A resistance soldering method for producing a plate assembly comprised of at least two elements that are materially bonded via a soldering device, comprising:
providing a first element and a second element spaced apart and, with respect to a mounting direction, arranged one above the other between a first electrode and a second electrode of the soldering device;
arranging a solder element between and in contact with the first element and the second element;
applying an output voltage to the first electrode and the second electrode to provide an electric circuit and solder the first element and the second element together via the solder element;
detecting a correct or incorrect position of the solder element in the plate assembly via a control unit;
determining via the control unit, upon the detection of the correct or incorrect position of the solder element in the plate assembly, a voltage between the solder element and one point on the electric circuit, or voltages between the solder element and mutually divergent points on the electric circuit, and
wherein the control unit detects the correct or incorrect position of the solder element via at least one of an evaluation and a comparison with reference to the voltage or voltages determined.