US 11,730,450 B2
Ultrasonic oscillator unit and ultrasonic endoscope using same
Yasuhiko Morimoto, Ashigarakami-gun (JP); and Katsuya Yamamoto, Ashigarakami-gun (JP)
Assigned to FUJIFILM Corporation, Tokyo (JP)
Filed by FUJIFILM Corporation, Tokyo (JP)
Filed on Sep. 24, 2018, as Appl. No. 16/139,643.
Application 16/139,643 is a continuation of application No. PCT/JP2017/006963, filed on Feb. 24, 2017.
Claims priority of application No. 2016-074448 (JP), filed on Apr. 1, 2016.
Prior Publication US 2019/0021696 A1, Jan. 24, 2019
Int. Cl. A61B 8/00 (2006.01); A61B 8/12 (2006.01); H04R 17/00 (2006.01); B06B 1/06 (2006.01); A61B 1/00 (2006.01); A61B 1/018 (2006.01)
CPC A61B 8/4455 (2013.01) [A61B 8/12 (2013.01); A61B 8/445 (2013.01); A61B 8/4483 (2013.01); A61B 8/4494 (2013.01); B06B 1/0625 (2013.01); H04R 17/00 (2013.01); A61B 1/00082 (2013.01); A61B 1/00096 (2013.01); A61B 1/00114 (2013.01); A61B 1/018 (2013.01); A61B 8/4416 (2013.01); A61B 8/4461 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An ultrasonic oscillator unit comprising:
an ultrasonic oscillator array in which a plurality of ultrasonic oscillators are arranged outward in a circular-arc shape so as to have a circular-arc surface resulting from the arrangement of the plurality of ultrasonic oscillators and end surfaces perpendicular to the circular-arc surface;
an electrode part having a plurality of electrodes provided on a side of one of the end surfaces of the ultrasonic oscillator array and electrically connected to the plurality of ultrasonic oscillators, respectively;
a backing material layer that is disposed on a back surface of the ultrasonic oscillator array, which is an inward surface of the ultrasonic oscillator array, the backing material layer having an outer surface having a circular-arc shape section, and the backing material layer being provided with recesses under the circular-arc shape section of the backing material and opposite to the outer surface of the backing material layer;
a wiring board having a plurality of wiring lines electrically connected to the plurality of electrodes of the electrode part; and
cable wiring parts which are respectively disposed on both of outer side surfaces of the backing material layer, in which a plurality of cables connected to the plurality of wiring lines, respectively, are wiring-connected,
wherein the recesses of the backing material layer are on a surface of the outer side surfaces of the backing material layer which is a surface having circular-arc cross-section perpendicular to an elevation direction which is a longitudinal direction of the ultrasonic oscillator array, and the recesses of the backing material layer are recessed in the elevation direction on a back side of a rear surface of the ultrasonic oscillator array, and are provided on both of the outer side surfaces of the backing material layer in order to dispose the respective cable wiring parts, and
at least a portion of the cable wiring parts is included in the recesses of the backing material layer.