US D1,142,309 S
Case for ear clip headphones
Yu Ai, Beijing (CN)
Filed by Beijing Techaoweijia Electronics Technology Co., Ltd., Beijing (CN)
Filed on Dec. 23, 2024, as Appl. No. 29/980,194.
Term of patent 15 Years
LOC (15) Cl. 03 - 01
U.S. Cl. D 3—294  [D13/108]
OG exemplary drawing
 
The ornamental design for a case for ear clip headphones as shown and described.