US 12,396,334 B2
Display apparatus and method of manufacturing the same
Won Je Jo, Ansan-si (KR); Young Ji Kim, Hwaseong-si (KR); Yi Seul Um, Chungcheongnam-do (KR); Young Hoon Lee, Gwangmyeong-si (KR); Seong Geun Won, Hwaseong-si (KR); Young Seo Choi, Yongin-si (KR); and Hyun Min Hwang, Seoul (KR)
Assigned to SAMSUNG DISPLAY CO., LTD., Gyeonggi-Do (KR)
Filed by Samsung Display Co., Ltd., Yongin-Si (KR)
Filed on Nov. 17, 2020, as Appl. No. 17/099,959.
Claims priority of application No. 10-2019-0147712 (KR), filed on Nov. 18, 2019.
Prior Publication US 2021/0151531 A1, May 20, 2021
Int. Cl. H01L 27/32 (2006.01); H10K 50/844 (2023.01); H10K 50/87 (2023.01); H10K 59/122 (2023.01); H10K 59/124 (2023.01); H10K 59/80 (2023.01); H10K 71/00 (2023.01); H10K 59/12 (2023.01); H10K 59/65 (2023.01)
CPC H10K 59/124 (2023.02) [H10K 50/844 (2023.02); H10K 50/87 (2023.02); H10K 59/122 (2023.02); H10K 59/8794 (2023.02); H10K 71/00 (2023.02); H10K 59/1201 (2023.02); H10K 59/65 (2023.02); H10K 59/8731 (2023.02)] 14 Claims
OG exemplary drawing
 
1. A display apparatus comprising:
a base substrate including a hole area through which light passes through the base substrate to or from an optical module disposed under the base substrate, a hole peripheral area which is a non-display area surrounding the hole area which overlaps the optical module, and a display area surrounding the hole peripheral area, wherein the display area includes a plurality of pixels to display an image;
an insulating layer disposed on the base substrate in the hole peripheral area and the display area except for the hole area;
a via insulating layer disposed on the insulating layer in the hole peripheral area and the display area except for the hole area;
a pixel defining layer disposed on the via insulating layer in the hole peripheral area and the display area except for the hole area; and
a thin film encapsulation layer including a first inorganic film and a second inorganic film, which are disposed in the hole peripheral area and the display area except for the hole area on the base substrate on which the via insulating layer is disposed,
wherein the base substrate defines a layer which is disposed between the optical module and the insulating layer, and
wherein the optical module is disposed only in the hole area, and
wherein the hole area is defined only by opposing ends defining the insulating layer and the thin film encapsulation layer.