US 12,396,303 B2
Light-emitting device and method for manufacturing the same
So Sakamaki, Anan (JP)
Assigned to NICHIA CORPORATION, Anan (JP)
Filed by NICHIA CORPORATION, Anan (JP)
Filed on Dec. 20, 2022, as Appl. No. 18/069,201.
Claims priority of application No. 2021-208354 (JP), filed on Dec. 22, 2021; and application No. 2022-017177 (JP), filed on Feb. 7, 2022.
Prior Publication US 2023/0197915 A1, Jun. 22, 2023
Int. Cl. H01L 33/60 (2010.01); H10H 20/01 (2025.01); H10H 20/851 (2025.01); H10H 20/856 (2025.01)
CPC H10H 20/856 (2025.01) [H10H 20/01 (2025.01); H10H 20/8513 (2025.01)] 19 Claims
OG exemplary drawing
 
1. A method for manufacturing a light-emitting device including a light-emitting element and a quantum dot configured to convert light emitted by the light-emitting element, the method comprising:
preparing a base and a light-emitting element having a surface and disposed on the base;
forming a light reflective member having an inner surface and a top surface and surrounding the light-emitting element;
forming a first barrier layer continuously covering the surface of the light-emitting element and the inner surface of the light reflective member and the top surface of the light reflective member;
forming a wavelength conversion member having a top surface and including the quantum dot in a region surrounded by the inner surface of the light reflective member, the light-emitting element being embedded in the wavelength conversion member; and
covering, with a second barrier layer, the top surface of the wavelength conversion member and at least a portion of the first barrier layer on the top surface of the light reflective member.