| CPC H10H 20/815 (2025.01) [H10H 20/01335 (2025.01); H10H 20/812 (2025.01); H10H 20/8162 (2025.01); H10H 20/825 (2025.01)] | 22 Claims |

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1. A device structure, comprising:
a GaN layer; and
a semibulk (SB) template comprising a plurality of stacked periods on the GaN layer, each period comprising a layer of InGaN and a GaN interlayer disposed on the layer of InGaN, where a thickness of the GaN interlayer of a top period of the plurality of stacked periods is greater than a thickness of the GaN interlayer of a bottom period of the plurality of stacked periods, the bottom period disposed on the GaN layer, wherein the layer of InGaN comprises p-InGaN or n-InGaN.
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