US 12,396,270 B2
Method of manufacturing a solar cell with integral cover glass, and cell obtained
Erminio Greco, Milan (IT); Mariacristina Casale, Milan (IT); and Roberta Campesato, Milan (IT)
Assigned to CESI—Centro Elettrotecnico Sperimentale Italiano Giacinto Motta S.p.A., Milan (IT)
Appl. No. 17/759,085
Filed by CESI—Centro Elettrotecnico Sperimentale Italiano Giacinto Motta S.P.A., Milan (IT)
PCT Filed Jan. 15, 2021, PCT No. PCT/EP2021/050818
§ 371(c)(1), (2) Date Jul. 19, 2022,
PCT Pub. No. WO2021/148323, PCT Pub. Date Jul. 29, 2021.
Claims priority of application No. 102020000001051 (IT), filed on Jan. 21, 2020.
Prior Publication US 2023/0039806 A1, Feb. 9, 2023
Int. Cl. H10F 19/80 (2025.01); H10F 77/30 (2025.01)
CPC H10F 19/807 (2025.01) [H10F 77/311 (2025.01)] 17 Claims
OG exemplary drawing
 
1. Method of fabrication of a semiconductor space solar cell for uses in the space or at high altitude in atmosphere, comprising:
providing a semiconductor solar cell having an active surface which, in use, is intended to be exposed to sunlight for performing photovoltaic conversion;
forming, in correspondence of said active surface, a protection against low-energy protons harmful to the solar cell,
characterized in that
said forming a protection comprises:
forming an adhesive layer of resin and
forming by means of deposition of material on the adhesive layer of resin a single layer of a non-conductive protective material, transparent in an electromagnetic radiation frequency range in which the solar cell is intended to perform the photovoltaic conversion, over the adhesive layer of resin, wherein said forming by means of deposition of material comprises a process or processes of physical vapour deposition—“PVD”,
wherein said single layer of a non-conductive protective material has a thickness greater than 2 μm.