US 12,396,237 B2
Semiconductor device and method for fabricating the same
Young Moon Choi, Seoul (KR); Sung Il Park, Suwon-si (KR); and Dae Won Ha, Seoul (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Jun. 6, 2022, as Appl. No. 17/833,058.
Claims priority of application No. 10-2021-0122934 (KR), filed on Sep. 15, 2021.
Prior Publication US 2023/0084804 A1, Mar. 16, 2023
Int. Cl. H10D 64/23 (2025.01); H10D 30/69 (2025.01)
CPC H10D 64/258 (2025.01) [H10D 30/797 (2025.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device comprising:
a first active pattern spaced apart from a substrate and extending in a first direction;
a second active pattern spaced apart from the substrate and extending in the first direction, the first active pattern being provided between the second active pattern and the substrate;
a gate structure extending in a second direction on the substrate, the first active pattern and the second active pattern passing through the gate structure, and the second direction crossing the first direction;
a first source/drain area connected with the first active pattern and provided on a side of the gate structure;
a second source/drain area connected with the second active pattern and provided on the first source/drain area;
a first insulating structure provided between the substrate and the first source/drain area, wherein the first insulating structure is not provided between the substrate and the gate structure; and
a second insulating structure provided between the first source/drain area and the second source/drain area,
wherein the second insulating structure is offset from the first active pattern and the second active pattern along a third direction that is perpendicular to the first direction and the second direction.