US 12,396,185 B2
Thin-film resistor (TFR) module including a TFR element formed in a metal cup structure
Yaojian Leng, Vancouver, WA (US)
Assigned to Microchip Technology Incorporated, Chandler, AZ (US)
Filed by Microchip Technology Incorporated, Chandler, AZ (US)
Filed on Jun. 7, 2022, as Appl. No. 17/834,065.
Claims priority of provisional application 63/338,121, filed on May 4, 2022.
Prior Publication US 2023/0361159 A1, Nov. 9, 2023
Int. Cl. H10D 1/47 (2025.01); H01C 7/00 (2006.01); H01C 17/075 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H10D 86/85 (2025.01)
CPC H10D 1/474 (2025.01) [H01C 7/006 (2013.01); H01C 17/075 (2013.01); H01L 21/76816 (2013.01); H01L 21/76843 (2013.01); H01L 23/5228 (2013.01); H10D 86/85 (2025.01)] 22 Claims
OG exemplary drawing
 
1. A thin film resistor (TFR) module, comprising:
a metal cup structure in a dielectric region between a lower metal layer Mx and an upper metal layer Mx+1, the metal cup structure including (a) a laterally-extending metal cup base and (b) multiple metal cup sidewalls extending upwardly from the laterally-extending metal cup base toward the upper metal layer Mx+1;
a dielectric liner region formed in an opening defined by the metal cup structure;
a TFR element formed in an opening defined by the dielectric liner region, wherein the TFR element is insulated from the metal cup structure by the dielectric liner region; and
a pair of TFR heads formed in the upper metal layer Mx+1 and electrically connected to the TFR element.