US 12,396,169 B2
Microelectronic devices and memory devices including support pillars
Shuangqiang Luo, Boise, ID (US); Indra V. Chary, Boise, ID (US); and Justin B. Dorhout, Boise, ID (US)
Assigned to Lodestar Licensing Group LLC, Evanston, IL (US)
Filed by Lodestar Licensing Group LLC, Evanston, IL (US)
Filed on Feb. 9, 2024, as Appl. No. 18/437,665.
Application 18/437,665 is a continuation of application No. 17/816,299, filed on Jul. 29, 2022, granted, now 11,910,598.
Application 17/816,299 is a continuation of application No. 16/908,287, filed on Jun. 22, 2020, granted, now 11,417,673, issued on Aug. 16, 2022.
Prior Publication US 2024/0188288 A1, Jun. 6, 2024
Int. Cl. H10B 41/27 (2023.01); G11C 5/02 (2006.01); G11C 5/06 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); H10B 43/27 (2023.01)
CPC H10B 41/27 (2023.02) [G11C 5/025 (2013.01); G11C 5/06 (2013.01); H01L 21/76838 (2013.01); H01L 23/5386 (2013.01); H01L 24/14 (2013.01); H10B 43/27 (2023.02)] 19 Claims
OG exemplary drawing
 
1. A microelectronic device, comprising:
blocks horizontally extending in parallel in a first direction and respectively comprising tiers each including conductive material and insulative material vertically neighboring the conductive material;
slot structures horizontally extending in parallel in the first direction and horizontally alternating with the blocks in a second direction orthogonal to the first direction;
pillar structures within horizontal areas of and vertically extending completely through the blocks; and
bridge structures vertically underlying the blocks and the slot structures, the bridge structures respectively extending in the second direction from one of the pillar structures within a horizontal area of one of the blocks to an additional one of the pillar structures within an additional horizontal area of an additional one of the blocks.