US 12,396,140 B2
System and method for hybrid direct-to-chip liquid and immersion cooling
Chao-Jung Chen, Taoyuan (TW); Yu-Nien Huang, Taoyuan (TW); and Herman Tan, Taoyuan (TW)
Assigned to QUANTA COMPUTER INC., Taoyuan (TW)
Filed by Quanta Computer Inc., Taoyuan (TW)
Filed on Sep. 22, 2023, as Appl. No. 18/473,199.
Claims priority of provisional application 63/515,537, filed on Jul. 25, 2023.
Prior Publication US 2025/0040101 A1, Jan. 30, 2025
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/2079 (2013.01) [H05K 7/20236 (2013.01); H05K 7/20254 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A hybrid cooling system for an information technology (IT) device, the hybrid cooling system comprising:
a chassis having a peripheral wall that extends between a chassis base and an open top surface, the peripheral wall forming an enclosure between an upstream side and a downstream side, the chassis being configured to receive heat-generating components of the IT device within the enclosure;
an immersion conduit for delivering an immersion coolant within the enclosure, the immersion coolant filling the enclosure to immerse the heat-generating components;
an outlet duct for draining overflow of the immersion coolant accumulated in the enclosure;
a cold plate positioned within the enclosure and configured for mounting in direct contact with at least one of the heat-generating components, the cold plate having an inlet connector and an outlet connector;
a supply conduit for delivering a direct coolant in cooled form within the cold plate, the supply conduit being in flow communication with the inlet connector; and
a return conduit for removing the direct coolant in heated form from the cold plate, the return conduit being in flow communication with the outlet connector;
wherein the chassis has a rear opening in the downstream side, the rear opening blocked by a movable flap in a closed position, the movable flap having a flap height that is lower than a wall height of the peripheral wall.