US 12,396,137 B2
Electronic module with leak-proof structure
I-Wen Chan, Taoyuan (TW)
Assigned to DELTA ELECTRONICS, INC., Taoyuan (TW)
Filed by Delta Electronics, Inc., Taoyuan (TW)
Filed on Sep. 12, 2023, as Appl. No. 18/465,591.
Claims priority of application No. 202310810036.5 (CN), filed on Jul. 4, 2023.
Prior Publication US 2025/0016961 A1, Jan. 9, 2025
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20463 (2013.01) [H05K 7/2029 (2013.01); H05K 7/20481 (2013.01)] 10 Claims
OG exemplary drawing
 
1. An electronic module with a leak-proof structure, comprising:
a carrier;
a heat source, disposed on the carrier;
a metal frame, disposed on the carrier, wherein the metal frame surrounds the heat source;
an elastic isolating member, disposed between the metal frame and the heat source, wherein the elastic isolating member comprises a continuous wall and a base plate, the base plate is connected to a bottom of the continuous wall, a central opening is formed on the base plate, the heat source corresponds to the central opening, and the continuous wall defines a receiving space;
a liquid-metal material, disposed on the heat source, wherein the elastic isolating member restricts the liquid-metal material; and
a heatsink, comprising a heatsink bottom and a protrusion, wherein the protrusion is formed on the heatsink bottom, the protrusion is inserted into the receiving space and contacts the liquid-metal material.