| CPC H05K 7/20263 (2013.01) [H05K 7/20254 (2013.01); H05K 7/20272 (2013.01); H05K 7/20318 (2013.01); H05K 7/20718 (2013.01); H05K 7/20763 (2013.01); H05K 7/208 (2013.01)] | 21 Claims |

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1. A cooling system for cooling one or more heat-generating electronic components of a computing system, the cooling system comprising:
a first stage having a first cooling path that is configured to circulate a first cooling fluid past the one or more heat-generating electronic components, the first cooling path causing the first cooling fluid to absorb heat from the one or more heat-generating electronic components such that a temperature of the first cooling fluid increases;
a second stage having a second cooling path that is configured to circulate a second cooling fluid, the second cooling path causing (i) an initial increase in a pressure of the second cooling fluid, (ii) subsequent to the initial increase in the pressure, heat to be removed from the second cooling fluid such that a temperature of the second cooling fluid decreases, and (iii) in response to the heat being removed, a decrease in the pressure of the second cooling fluid to further decrease the temperature of the second cooling fluid; and
a heat exchanger fluidly connected to the first cooling path and the second cooling path, the heat exchanger being configured to cause the second cooling fluid to flow past and absorb heat from the first cooling fluid, the temperature of the second cooling fluid increasing in response to absorbing the heat from the first cooling fluid,
wherein the first stage, the second stage, the heat exchanger, and the one or more heat-generating electronic components of the computing system are all positioned within a housing of the computing system,
wherein the first cooling fluid remains in a liquid phase as the first cooling fluid circulates through the first stage, and
wherein the second cooling fluid transitions between a liquid phase and a vapor phase as the second cooling fluid circulates through the second stage.
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