US 12,396,124 B2
Fan module interconnect apparatus for electronic devices
Chee How Lim, Bukit Mertajam (MY); Khai Ern See, Batu Gaja (MY); Chin Kung Goh, Pulau Pinang (MY); and Twan Sing Loo, Butterworth (MY)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Dec. 23, 2020, as Appl. No. 17/132,846.
Prior Publication US 2021/0120699 A1, Apr. 22, 2021
Int. Cl. H05K 7/20 (2006.01); G06F 1/20 (2006.01)
CPC H05K 7/20172 (2013.01) [G06F 1/203 (2013.01); G06F 2200/201 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A fan module comprising:
a fan;
a fan housing to carry the fan, the fan to rotate in the fan housing to remove heat from electronic components of a circuit board; and
a flange extending from the fan housing, the flange including:
one or more electrically conductive traces on at least one of an outer surface or an internal surface of the flange, the one or more electrically conductive traces extending between a first side of the flange and a second side of the flange opposite the first side;
a first electrical connector at the first side of the flange, the first electrical connector to electrically couple at least one of the one or more electrically conductive traces and a first electrical circuit of an electronic device; and
a second electrical connector at the second side of the flange, the second electrical connector to electrically couple the at least one of the one or more electrically conductive traces and a second electrical circuit of the electronic device, and the one or more electrically conductive traces of the flange communicatively couple a first portion of the circuit board and a second portion of the circuit board via the first and second electrical connectors, respectively.