US 12,396,104 B2
Release film
Hun-Tae Kim, Seoul (KR); Gyumdong Bae, Cheonan-si (KR); and Dongho Yoon, Anyang-si (KR)
Assigned to SAMSUNG DISPLAY CO., LTD., Gyeonggi-Do (KR)
Filed by Samsung Display Co., Ltd., Yongin-si (KR)
Filed on Mar. 4, 2022, as Appl. No. 17/686,946.
Claims priority of application No. 10-2021-0065754 (KR), filed on May 21, 2021.
Prior Publication US 2022/0377908 A1, Nov. 24, 2022
Int. Cl. H05K 3/28 (2006.01); H01L 25/18 (2023.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); H10K 59/131 (2023.01); H10K 59/80 (2023.01)
CPC H05K 3/281 (2013.01) [H05K 1/147 (2013.01); H05K 1/189 (2013.01); H05K 3/288 (2013.01); H10K 59/871 (2023.02); H01L 25/18 (2013.01); H05K 2201/10128 (2013.01); H05K 2203/304 (2013.01); H10K 59/131 (2023.02); H10K 59/873 (2023.02)] 21 Claims
OG exemplary drawing
 
1. A release film on a printed circuit board and a connector connected to the printed circuit board, the release film comprising:
a first release film disposed on a first surface of the printed circuit board and a surface of the connector;
a second release film disposed on a second surface of the printed circuit board opposite to the first surface of the printed circuit board; and
a first adhesive attached to a portion of a surface of the first release film which does not overlap the second release film, the first adhesive comprising:
a base film disposed on the surface of the first release film facing the printed circuit board; and
a double-sided adhesive disposed between the first release film and the base film,
wherein the base film extends in a direction parallel to an extension direction of the first release film, and
the base film covers a portion of a surface of the second release film which does not directly face the first release film.