US 12,396,100 B2
Circuit board structure and manufacturing method thereof
Chun Hung Kuo, Taoyuan (TW); Kuo-Ching Chen, Taoyuan (TW); Yu-Cheng Huang, Taoyuan (TW); and Yu-Hua Chen, Taoyuan (TW)
Assigned to UNIMICRON TECHNOLOGY CORP., Taoyuan (TW)
Filed by UNIMICRON TECHNOLOGY CORP., Taoyuan (TW)
Filed on Jun. 2, 2023, as Appl. No. 18/205,240.
Claims priority of application No. 112117285 (TW), filed on May 10, 2023.
Prior Publication US 2024/0381533 A1, Nov. 14, 2024
Int. Cl. H05K 1/14 (2006.01); H05K 1/16 (2006.01); H05K 3/00 (2006.01)
CPC H05K 1/142 (2013.01) [H05K 1/141 (2013.01); H05K 1/165 (2013.01); H05K 3/0014 (2013.01); H05K 2201/086 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A circuit board structure, comprising:
a first circuit board, having a first side surface, wherein a normal direction of the first side surface is perpendicular to a thickness direction of the first circuit board;
a second circuit board, having a second side surface facing the first side surface and being spaced apart from the first side surface, wherein a normal direction of the second side surface is perpendicular to a thickness direction of the second circuit board;
a conductive coil, in a spiral shape and comprising a first coil pattern and a second coil pattern, wherein the first coil pattern is disposed in the first circuit board, the second coil pattern is disposed in the second circuit board, and the first coil pattern is electrically connected to the second coil pattern; and
a first molding compound, being magnetic and filled in a gap located between the first side surface and the second side surface, wherein the conductive coil surrounds at least a part of the first molding compound;
wherein the first coil pattern is exposed to the gap from the first side surface and the second coil pattern is exposed to the gap from the second side surface.