US 12,396,097 B2
Substrates with continuous slot vias
Travis M. Jensen, Boise, ID (US); Walter L. Moden, Boise, ID (US); and Stephen F. Moxham, Boise, ID (US)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Aug. 30, 2022, as Appl. No. 17/899,477.
Prior Publication US 2024/0074055 A1, Feb. 29, 2024
Int. Cl. H05K 1/11 (2006.01); H01L 21/48 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H05K 3/00 (2006.01); H05K 3/40 (2006.01); H01L 23/00 (2006.01)
CPC H05K 1/116 (2013.01) [H01L 21/4846 (2013.01); H01L 23/481 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H05K 3/0014 (2013.01); H05K 3/0047 (2013.01); H05K 3/4038 (2013.01); H01L 24/16 (2013.01); H01L 2224/16227 (2013.01); H05K 2201/09563 (2013.01); H05K 2201/09636 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A substrate, comprising:
a first design layer, a second design layer, and an intermediary layer positioned between the first design layer and the second design layer;
a first signaling via extending vertically through the intermediary layer between the first design layer and the second design layer, the first signaling via configured to route first data signals between the first design layer and the second design layer;
a second signaling via extending vertically through the intermediary layer between the first design layer and the second design layer, the second signaling via configured to route second data signals between the first design layer and the second design layer;
a first trace extending laterally across the first design layer and coupled to the first signaling via;
a second trace extending laterally across the first design layer and coupled to the second signaling via;
a slot via extending vertically at least partially through the intermediary layer between the first design layer and the second design layer;
a first capture pad; and
a second capture pad,
wherein the slot via extends from the first capture pad to the second capture pad through the intermediary layer, is positioned within the intermediary layer between the first signaling via and the second signaling via, and extends laterally within the intermediary layer along a path that passes between the first signaling via and the second signaling via, and
wherein the first capture pad and/or the slot via is shaped such that the first capture pad and/or the slot via at least partially tracks the first trace, the second trace, or a combination thereof.