US 12,396,094 B2
Circuit substrate and module
Hisashi Suzuki, Kyoto (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Kyoto (JP)
Filed on Mar. 24, 2023, as Appl. No. 18/189,460.
Application 18/189,460 is a continuation of application No. PCT/JP2021/034828, filed on Sep. 22, 2021.
Claims priority of application No. 2020-160822 (JP), filed on Sep. 25, 2020.
Prior Publication US 2023/0232531 A1, Jul. 20, 2023
Int. Cl. H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/18 (2006.01)
CPC H05K 1/111 (2013.01) [H05K 1/0271 (2013.01); H05K 1/0306 (2013.01); H05K 1/181 (2013.01); H05K 2201/068 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A circuit board comprising:
a substrate;
at least one electrode pad on a surface of the substrate; and
at least one projecting electrode on the electrode pad,
wherein the electrode pad on which the projecting electrode is disposed is larger than the projecting electrode when viewed from above,
the circuit board further comprises a coating layer covering at least a portion of an outer periphery of the electrode pad on which the projecting electrode is disposed,
the electrode pad has a portion exposed without being covered by the coating layer when the electrode pad is viewed from above, and
the coating layer covers the electrode pad disposed at a corner of the circuit board when the circuit board is viewed from above.