US 12,396,093 B2
Power supply module and power device
Xiaojing Liao, Shanghai (CN); and Hao Peng, Shanghai (CN)
Assigned to Huawei Digital Power Technologies Co., Ltd., Shenzhen (CN)
Filed by Huawei Digital Power Technologies Co., Ltd., Shenzhen (CN)
Filed on Jul. 27, 2022, as Appl. No. 17/874,594.
Claims priority of application No. 202110848867.2 (CN), filed on Jul. 27, 2021.
Prior Publication US 2023/0036995 A1, Feb. 2, 2023
Int. Cl. H05K 1/11 (2006.01); H05K 1/02 (2006.01)
CPC H05K 1/111 (2013.01) [H05K 1/0207 (2013.01); H05K 1/0209 (2013.01); H05K 2201/09381 (2013.01); H05K 2201/10303 (2013.01); H05K 2201/10704 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A power supply module, comprising:
a main body comprising a package body, a package base layer, and a power chip;
a first solder pad, a second solder pad; and
a plurality of metal connection pillars, wherein the package base layer, the power chip, and the first solder pad are all disposed in the package body,
the power chip is connected to the package base layer,
an end of the power chip away from the package base layer is connected to the first solder pad,
a first end of each of the metal connection pillars is connected to the first solder pad,
and a second end of the metal connection pillar extends through the main body to an outer side of a first surface of the main body, to form a plurality of protruding parts on an outer portion of the first surface of the main body;
wherein the first solder pad is connected to the second solder pad,
the second solder pad is in a second surface of the main body opposite to the first surface of the main body, and the second solder pad is exposed to exterior of the main body;
wherein the package base layer further comprises:
a thermally conductive substrate,
a first heat dissipation layer
and a second heat dissipation layer are disposed on two sides of the thermally conductive substrate,
the power chip is disposed on the first heat dissipation layer,
and the second heat dissipation layer is exposed from the package body;
a metal block,
wherein the metal block is configured to be fastened to the first heat dissipation layer and connected to the first solder pad,
and a surface of the metal block away from the package base layer is coplanar with a surface of the power chip away from the package substrate;
wherein the power device further comprises:
a connection structure having a plurality of supporting parts to maintain stability of connection with a circuit board.