US 12,396,090 B2
Radio-frequency module and communication device
Tetsuro Harada, Kyoto (JP); Dai Nakagawa, Kyoto (JP); Yuji Takematsu, Kyoto (JP); Hiroaki Takaoka, Kyoto (JP); and Takahisa Toyomura, Kyoto (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Kyoto (JP)
Filed on Jun. 9, 2023, as Appl. No. 18/332,251.
Application 18/332,251 is a continuation of application No. PCT/JP2021/036218, filed on Sep. 30, 2021.
Claims priority of application No. 2020-217807 (JP), filed on Dec. 25, 2020.
Prior Publication US 2023/0319984 A1, Oct. 5, 2023
Int. Cl. H05K 1/02 (2006.01)
CPC H05K 1/0243 (2013.01) [H05K 2201/1003 (2013.01); H05K 2201/10098 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A radio-frequency module comprising:
an antenna terminal;
a signal input terminal to which a transmitting signal is input;
a signal output terminal from which a receiving signal is output;
a mounting substrate having a first major surface and a second major surface opposite to each other in a thickness direction of the mounting substrate;
a chip inductor mounted on the first major surface of the mounting substrate, and connected in a transmitting path between the antenna terminal and the signal input terminal or in a receiving path between the antenna terminal and the signal output terminal; and
a directional coupler mounted on the second major surface of the mounting substrate, and at least partly connected in the transmitting path.