US 12,396,089 B2
Electronic device capable of suppressing high ground impedance, and method for manufacturing the electronic device
Shuichi Nakamura, Chiba (JP)
Assigned to CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on Mar. 8, 2023, as Appl. No. 18/180,392.
Claims priority of application No. 2022-051124 (JP), filed on Mar. 28, 2022.
Prior Publication US 2023/0309214 A1, Sep. 28, 2023
Int. Cl. H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/40 (2006.01); H05K 9/00 (2006.01)
CPC H05K 1/0224 (2013.01) [H05K 1/115 (2013.01); H05K 3/4038 (2013.01); H05K 9/0032 (2013.01); H05K 2201/10984 (2013.01)] 11 Claims
OG exemplary drawing
 
1. An electronic device including:
a printed circuit board comprising at least one ground layer that has conductivity, wherein the at least one ground layer is provided at a location in a middle in a thickness direction of the printed circuit board; and
a shield case that is placed on one side of the printed circuit board and that is comprised of a hollow body that has conductivity,
wherein at least one through hole passing through the at least one ground layer is formed in the printed circuit board,
at least one projecting portion to be inserted into the at least one through hole is formed in a projecting manner in the shield case,
in a state of being inserted in the through hole, the projecting portion is electrically connected to the at least one ground layer via solder,
the printed circuit board comprises a front-side ground layer that has conductivity and is different from the ground layer, wherein the front-side ground layer is provided on the one side,
the projecting portion is electrically connected to the front-side ground layer via the solder,
the printed circuit board comprises a connecting portion that has conductivity, wherein the connecting portion is provided in an inner peripheral portion of the through hole and electrically connects the at least one ground layer and the front-side ground layer to each other, and
the projecting portion is electrically connected to the connecting portion via the solder.