US 12,396,088 B2
Circuit board assembly and method for manufacturing the same
Xin Lu, Huai an (CN); and Wei-Xiang Li, Shenzhen (CN)
Assigned to QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Huai an (CN); Avary Holding (Shenzhen) Co., Limited., Shenzhen (CN); and GARUDA TECHNOLOGY CO., LTD., New Taipei (TW)
Filed by QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Huai an (CN); Avary Holding (Shenzhen) Co., Limited., Shenzhen (CN); and GARUDA TECHNOLOGY CO., LTD., New Taipei (TW)
Filed on Jan. 13, 2023, as Appl. No. 18/097,095.
Application 18/097,095 is a continuation in part of application No. PCT/CN2021/100742, filed on Jun. 17, 2021.
Prior Publication US 2023/0156906 A1, May 18, 2023
Int. Cl. H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/32 (2006.01)
CPC H05K 1/021 (2013.01) [H05K 1/183 (2013.01); H05K 3/32 (2013.01); H05K 1/0203 (2013.01); H05K 2201/10121 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A circuit board assembly, comprising:
an inner circuit substrate;
a first outer circuit substrate disposed on a surface of the inner circuit substrate;
a second outer circuit substrate disposed on another surface of the inner circuit substrate away from the first outer circuit substrate;
a heat conducting block penetrating through the inner circuit substrate and connecting to each of the first outer circuit substrate and the second outer circuit substrate, and an accommodating groove with an opening towards the first outer circuit substrate defined on the heat conducting block, the heat conducting block made of aluminum nitride;
a lens module comprising a chip and a lens, the chip accommodated in the accommodating groove and electrically connected to the first outer circuit substrate, the lens disposed on a surface of the first outer circuit substrate and electrically connected to the chip, and the chip and the lens cooperatively forming a hollow cavity; and
a reinforcing plate disposed on a surface of the second outer circuit substrate corresponding to the lens module and facing away from the lens module.