US 12,396,087 B2
Printed circuit board and circuit arrangement
Jochen Mahlein, Karlsruhe (DE); Leobald Podbielski, Karlsruhe (DE); and Martin Filsinger, Kraichtal (DE)
Assigned to SEW-EURODRIVE GMBH & CO. KG, Bruchsal (DE)
Appl. No. 18/025,412
Filed by SEW-EURODRIVE GMBH & CO. KG, Bruchsal (DE)
PCT Filed Sep. 2, 2021, PCT No. PCT/EP2021/074302
§ 371(c)(1), (2) Date Mar. 9, 2023,
PCT Pub. No. WO2022/053397, PCT Pub. Date Mar. 17, 2022.
Claims priority of application No. 102020005541.9 (DE), filed on Sep. 10, 2020.
Prior Publication US 2023/0337352 A1, Oct. 19, 2023
Int. Cl. H05K 1/02 (2006.01)
CPC H05K 1/0206 (2013.01) [H05K 1/0298 (2013.01); H05K 2201/066 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A printed circuit board, comprising:
a top side adapted to receive electrical components;
a bottom side adapted to receive a heat sink;
a plurality of electrically conductive layers;
a plurality of electrically insulating insulation layers, including a main insulation layer arranged between the top side and the bottom side, the main insulation layer completely electrically insulating the electrically conductive layers that are arranged between the main insulation layer and the top side from the electrically conductive layers that are arranged between the main insulation layer and the bottom side;
a plurality of upper plated through-holes extending at least from an outer insulation layer adjacent to the top side into an inner insulation layer adjacent to the main insulation layer; and
a plurality of lower plated through-holes extending at least from the bottom side into a lower insulation layer adjacent to the main insulation layer;
wherein one of the electrically conductive layer is positioned directly against a surface of the main insulation layer facing the bottom side, and a plurality of the lower plated through-holes extend from the bottom side through the lower insulation layer adjacent to the main insulation layer to the one of the electrically conductive layers.