	US 12,395,778 B2
	Sensor device
Yongshuai Yuan, Shenzhen (CN); Wenjun Deng, Shenzhen (CN); Wenbing Zhou, Shenzhen (CN); Yujia Huang, Shenzhen (CN); Fengyun Liao, Shenzhen (CN); and Xin Qi, Shenzhen (CN)
Assigned to SHENZHEN SHOKZ CO., LTD., Shenzhen (CN)
Filed by SHENZHEN SHOKZ CO., LTD., Guangdong (CN)
Filed on Jul. 12, 2023, as Appl. No. 18/351,480.
Application 18/351,480 is a continuation of application No. PCT/CN2021/112030, filed on Aug. 11, 2021.
Claims priority of application No. 202110445739.3 (CN), filed on Apr. 23, 2021.
Prior Publication US 2023/0362524 A1, Nov. 9, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H04R 1/22 (2006.01); G01H 11/08 (2006.01); G01N 29/036 (2006.01); G01N 29/24 (2006.01); G01P 1/02 (2006.01); H04R 1/08 (2006.01); H04R 1/20 (2006.01); H04R 17/02 (2006.01); H04R 17/10 (2006.01); H04R 19/04 (2006.01)

CPC H04R 1/222 (2013.01) [G01H 11/08 (2013.01); G01N 29/036 (2013.01); G01N 29/2406 (2013.01); G01N 29/2437 (2013.01); G01P 1/023 (2013.01); H04R 1/08 (2013.01); H04R 1/20 (2013.01); H04R 17/02 (2013.01); H04R 17/10 (2013.01); H04R 19/04 (2013.01); G01N 2291/014 (2013.01); G01N 2291/022 (2013.01)]

20 Claims

1. A sensor device, comprising:

a sensor assembly with a first resonant frequency; and

a sound pickup assembly configured to communicate with an external sound of the sensor device through a sound inlet, wherein an acoustic cavity is formed between the sound pickup assembly and the sensor assembly, when the sound pickup assembly vibrates in response to an air conduction sound transmitted through the sound inlet, vibrations of the sound pickup assembly change a sound pressure in the acoustic cavity, and the sensor assembly converts the air conduction sound into an electrical signal based on changes of the sound pressure in the acoustic cavity, wherein the sound pickup assembly provides the sensor device with a second resonant frequency, and a difference between the second resonant frequency and the first resonant frequency is in a range of 1000 Hz-10000 Hz.