US 12,395,246 B2
Optically-enhanced multichip packaging
Robert Kalman, Menlo Park, CA (US); Bardia Pezeshki, Menlo Park, CA (US); Alexander Tselikov, Sunnyvale, CA (US); and Cameron Danesh, Sunnyvale, CA (US)
Assigned to AvicenaTech, Corp., Sunnyvale, CA (US)
Filed by AvicenaTech Corp., Sunnyvale, CA (US)
Filed on Jun. 27, 2023, as Appl. No. 18/215,056.
Application 18/215,056 is a continuation of application No. 17/229,652, filed on Apr. 13, 2021, granted, now 11,728,894.
Claims priority of provisional application 63/009,161, filed on Apr. 13, 2020.
Prior Publication US 2023/0344518 A1, Oct. 26, 2023
Int. Cl. H04B 10/40 (2013.01); G02B 6/42 (2006.01); G02B 6/43 (2006.01); H04B 10/50 (2013.01)
CPC H04B 10/40 (2013.01) [G02B 6/4246 (2013.01); G02B 6/43 (2013.01); H04B 10/502 (2013.01)] 8 Claims
OG exemplary drawing
 
1. Optically interconnected integrated circuits, comprising:
a substrate having a first hole and a second hole, the first hole and the second hole each extending through the substrate;
a first integrated circuit (IC) chip, including logic circuitry, mounted to the substrate;
a first transceiver IC chip electrically connected to the first IC chip and mounted to the substrate and having a first active side facing the substrate with a portion of the first active side having a first plurality optoelectronic devices hanging over the first hole of the substrate;
the first plurality of optoelectronic devices having a first array of microLEDs and a first array of photodetectors;
the first plurality of optoelectronic devices coupled to the first transceiver IC chip by way of direct bonds;
a second IC chip, including logic circuitry, mounted to the substrate;
a second transceiver IC chip electrically connected to the second IC chip and mounted to the substrate, the second transceiver IC chip having a second active side facing the substrate with a portion of the second active side having a second plurality optoelectronic devices hanging over the second hole of the substrate;
the second plurality of optoelectronic devices having a second array of microLEDs and a second array of photodetectors;
the second plurality of optoelectronic devices coupled to the second transceiver IC chip by way of direct bonds;
a first optical coupling assembly on the first plurality of optoelectronic devices and a second optical coupling assembly on the second plurality of optoelectronic devices, the first optical coupling assembly at least in part in the first hole in the substrate and the second optical coupling assembly at least in part in the second hole in the substrate;
a waveguide having a plurality of waveguide cores inside the first hole and the second hole of the substrate and optically coupling the first and second plurality of optoelectronic devices.