US 12,395,095 B2
Commutation cell, flying capacitor module and multilevel converter
Raphael Hartwig, Freystadt (DE); and Alexander Hensler, Gerhardshofen (DE)
Assigned to Siemens Aktiengesellschaft, Munich (DE)
Appl. No. 18/274,862
Filed by Siemens Aktiengesellschaft, Munich (DE)
PCT Filed Dec. 21, 2021, PCT No. PCT/EP2021/086917
§ 371(c)(1), (2) Date Jul. 28, 2023,
PCT Pub. No. WO2022/161707, PCT Pub. Date Aug. 4, 2022.
Claims priority of application No. 21154385 (EP), filed on Jan. 29, 2021.
Prior Publication US 2024/0113637 A1, Apr. 4, 2024
Int. Cl. H02M 7/483 (2007.01); H02M 7/00 (2006.01)
CPC H02M 7/4837 (2021.05) [H02M 7/003 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A commutation cell for a flying capacitor module, the commutation cell comprising:
a circuit board having a first side and an opposite second side;
a first semiconductor comprising a first terminal connected to a first d.c. voltage phase and a second terminal;
a second semiconductor comprising a third terminal connected to a second d.c. voltage phase and fourth terminal;
a first capacitor and a second capacitor formed as low-inductance commutation capacitors and connected in parallel between the first and third terminal;
a third capacitor and a fourth capacitor formed as low-inductance commutation capacitors and connected in parallel between the second and fourth terminal,
wherein for an overall reduction in the parasitic inductances
the second and fourth capacitors are arranged on the first side and the first and third capacitors are arranged on the second side of the circuit board, with the first and third capacitors being connected to the second and fourth capacitors at the terminals by vias,
the first and third capacitors form a first commutation path on the first side, the second and the fourth capacitors form a second commutation path on the second side, the second and the third capacitors form a third commutation path and the first and the fourth capacitors form a fourth commutation path, with the third and fourth commutation paths being formed along the vias and on the first and second sides; and
the commutation cell further comprising
a first flying capacitor connected between the first d.c. voltage phase and the second d.c. voltage phase in parallel with the first and second capacitors on an input side of the commutation cell; and
a second flying capacitor connected between the first d.c. voltage phase and the second d.c. voltage phase in parallel with the third and fourth capacitor on an output side of the commutation cell.