US 12,395,074 B2
Power semiconductor package
David Giuliano, San Diego, CA (US)
Assigned to Murata Manufacturing Co., Ltd., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Kyoto (JP)
Filed on Feb. 26, 2024, as Appl. No. 18/587,418.
Application 18/587,418 is a continuation of application No. 17/357,884, filed on Jun. 24, 2021, granted, now 11,916,475.
Prior Publication US 2024/0283356 A1, Aug. 22, 2024
Int. Cl. H02M 3/00 (2006.01); H02M 1/00 (2006.01); H02M 3/158 (2006.01)
CPC H02M 3/003 (2021.05) [H02M 1/0006 (2021.05); H02M 1/0095 (2021.05); H02M 3/158 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
a series-capacitor converter including a plurality of power semiconductor packages, wherein at least one package in the plurality of power semiconductor packages comprises:
a power transfer path comprising at least a high-side switch and a low-side switch;
a first terminal coupled to a first node of the high-side switch;
a second terminal coupled to a second node of the low-side switch;
a high-side switch terminal coupled to a second node of the high-side switch;
a low-side switch terminal coupled to a first node of the low-side switch, wherein the high-side switch terminal and the low-side switch terminal comprise separate terminals; and
a plurality of lead frame contacts for receiving control signals, the plurality of lead frame contacts being arranged along an edge of an individual power semiconductor package.