US 12,395,064 B2
Semiconductor module
Isao Kakebe, Matsumoto (JP)
Assigned to FUJI ELECTRIC CO., LTD., Kawasaki (JP)
Filed by FUJI ELECTRIC CO., LTD., Kawasaki (JP)
Filed on Aug. 23, 2023, as Appl. No. 18/236,984.
Claims priority of application No. 2022-147659 (JP), filed on Sep. 16, 2022.
Prior Publication US 2024/0097556 A1, Mar. 21, 2024
Int. Cl. H02M 1/08 (2006.01); H02M 1/00 (2006.01); H02M 1/088 (2006.01); H02M 1/32 (2007.01); H02M 7/5387 (2007.01)
CPC H02M 1/088 (2013.01) [H02M 1/0009 (2021.05); H02M 1/0019 (2021.05); H02M 1/0025 (2021.05); H02M 1/32 (2013.01); H02M 7/53875 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A semiconductor module comprising:
a plurality of semiconductor switching elements configured to supply power to a load; and
a plurality of driver circuits in which drive targets are set in a one-to-one relationship to the plurality of semiconductor switching elements and in which according to a positional relationship to each of target switching elements that are the semiconductor switching elements as the drive targets, a driving capability to drive the each target switching element is set, wherein each of the plurality of driver circuits includes a protection unit configured to protect the each target switching element of the driver circuit, wherein the protection unit of the each of the plurality of driver circuits is configured to protect the each target switching element of the driver circuit on a basis of a threshold value set according to the positional relationship of the driver circuit including the protection unit itself.