US 12,394,767 B2
Electronic devices and methods of manufacturing electronic devices
Won Myoung Ki, Incheon (KR); In Su Mok, Incheon (KR); Soo Hyun Kim, Incheon (KR); Tae Kyeong Hwang, Seoul (KR); Shaun Bowers, Gilbert, AZ (US); and George Scott, Chandler, AZ (US)
Assigned to Amkor Technology Singapore Holding Pte. Ltd., Singapore (SG)
Filed by Amkor Technology Singapore Holding Pte. Ltd., Valley Point (SG)
Filed on Sep. 30, 2022, as Appl. No. 17/958,007.
Prior Publication US 2024/0113090 A1, Apr. 4, 2024
Int. Cl. H01L 25/16 (2023.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01)
CPC H01L 25/16 (2013.01) [H01L 21/563 (2013.01); H01L 21/568 (2013.01); H01L 23/3185 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 2224/05073 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/05611 (2013.01); H01L 2224/05613 (2013.01); H01L 2224/05616 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13083 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13113 (2013.01); H01L 2224/13116 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/13164 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16265 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/92125 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/0133 (2013.01); H01L 2924/18161 (2013.01); H01L 2924/19103 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
an electronic component including a component first side, a component second side opposite to the component first side, and a component lateral side connecting the component first side to the component second side, wherein the component lateral side defines a perimeter of the electronic component;
a component redistribution structure coupled to the component first side, the component redistribution structure comprising a redistribution conductive structure and a redistribution dielectric structure;
a first intermediate terminal coupled to the electronic component within the perimeter;
an intermediate component coupled to the first intermediate terminal within the perimeter;
a device interface structure comprising an interface conductive structure and an interface dielectric structure; and
an encapsulant structure over the intermediate component, at least a portion of the first intermediate terminal, and at least a portion of the electronic component, wherein:
the first intermediate terminal is coupled to the interface conductive structure; and
the first intermediate terminal is coupled to the redistribution conductive structure.