US 12,394,766 B2
Assembly of semiconductor power modules
Emmanuel Marcault, Grenoble (FR); and Sarah Soulie, Grenoble (FR)
Assigned to COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES, Paris (FR)
Filed by COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES, Paris (FR)
Filed on Oct. 8, 2021, as Appl. No. 17/450,300.
Claims priority of application No. 20 10945 (FR), filed on Oct. 26, 2020.
Prior Publication US 2022/0131459 A1, Apr. 28, 2022
Int. Cl. H05K 7/20 (2006.01); H01L 25/11 (2006.01); H02M 3/00 (2006.01); H02M 3/158 (2006.01); H05K 7/14 (2006.01)
CPC H01L 25/117 (2013.01) [H02M 3/003 (2021.05); H02M 3/158 (2013.01); H05K 7/14329 (2022.08); H05K 7/209 (2013.01)] 27 Claims
OG exemplary drawing
 
1. An assembly of power modules, comprising at least two superposed power modules, each power module comprising:
an electrically insulating substrate, defining opposing main faces,
at least a first semiconductor component and a second semiconductor component disposed one on top of the other on either side of the substrate and resting on main faces of the substrate, each component having at least two power contacts,
a first connection element electrically connected to a first power contact of the first component and to a first power contact of the second component,
a second connection element electrically connected to a second power contact of the first component, and
a third connection element electrically connected to a second power contact of the second component,
the first connection elements of the modules being disposed on the same side of the assembly,
the second connection elements of the modules being disposed on the same side of the assembly, and
the third connection elements of the modules being disposed on the same side of the assembly.