US 12,394,754 B2
Device and method for UBM/RDL routing
Meng-Tsan Lee, Hsinchu (TW); Wei-Cheng Wu, Hsinchu (TW); and Tsung-Shu Lin, New Taipei (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Jan. 20, 2021, as Appl. No. 17/153,304.
Application 16/562,990 is a division of application No. 15/157,312, filed on May 17, 2016.
Application 17/153,304 is a continuation of application No. 16/562,990, filed on Sep. 6, 2019.
Prior Publication US 2021/0143131 A1, May 13, 2021
Int. Cl. H01L 25/065 (2023.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 25/00 (2006.01); H01L 25/10 (2006.01)
CPC H01L 25/0657 (2013.01) [H01L 21/565 (2013.01); H01L 21/78 (2013.01); H01L 23/3121 (2013.01); H01L 23/481 (2013.01); H01L 23/49811 (2013.01); H01L 23/5389 (2013.01); H01L 24/03 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 25/105 (2013.01); H01L 25/50 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/0237 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/05024 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/13022 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13124 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/13164 (2013.01); H01L 2224/13609 (2013.01); H01L 2224/13611 (2013.01); H01L 2224/13616 (2013.01); H01L 2224/13639 (2013.01); H01L 2224/13644 (2013.01); H01L 2224/13655 (2013.01); H01L 2224/13664 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73257 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/92244 (2013.01); H01L 2224/97 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06568 (2013.01); H01L 2225/06572 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/10252 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10271 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/10331 (2013.01); H01L 2924/10332 (2013.01); H01L 2924/10333 (2013.01); H01L 2924/10335 (2013.01); H01L 2924/10336 (2013.01); H01L 2924/10337 (2013.01); H01L 2924/10338 (2013.01); H01L 2924/10339 (2013.01); H01L 2924/10342 (2013.01); H01L 2924/10351 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1432 (2013.01); H01L 2924/14335 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/1437 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/15311 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A micro-electromechanical systems (MEMS) package structure, comprising:
a circuit layer;
a MEMS die on the circuit layer;
an adhesive in physical contact with the MEMS die;
a conductive pillar having a top surface and disposed on the circuit layer adjacent to the MEMS die;
an encapsulant on the circuit layer and encapsulating the MEMS die and the conductive pillar, the encapsulant being a single material and having a constant thickness, wherein the conductive pillar has a height at least as high as a largest height of the encapsulant and at least as high as a largest height of a combination of the MEMS die and the adhesive in physical contact with the MEMS die; and
a polymer layer disposed on the encapsulant and on the top surface of the conductive pillar, wherein the polymer layer defines a recess that exposes at least a portion of the top surface of the conductive pillar, wherein the polymer layer comprises openings, wherein the openings are the only openings through the polymer layer, the recess being one of the openings, and wherein each of the openings within the polymer layer exposes a conductive material, the conductive pillar being part of the conductive material.